DC (direct current) sputtering is a material deposition process used to coat substrate structures with thin films of different materials. The process involves bombarding a donor material with ionized gas molecules, causing a displacement of donor atoms. These atoms then adhere to a negatively charged recipient material creating a thin film on its surface. This technique is used extensively in the electronics industry to construct semiconductor components and printed circuit boards (PCBs). It may, however, be appropriate for many other applications, such as non-reflective coatings on glass optic elements, metalized packaging plastics, and double glazing coatings.
The application of very thin layers or films of material on sensitive surfaces is generally achieved by a sputtering processes. This type of material deposition is achieved by passing a high tension electric current through an inert, low pressure gas, such as argon, which surrounds a donor and recipient material. The high energy plasma created causes rapidly accelerated ions to strike the donor material, displacing its atoms. The donor atoms then strike and adhere to the target or recipient material at an atomic level and create a very thin, even film. DC sputtering is capable of extremely accurate and controllable material deposition on a wide variety of substrate surfaces.
Reference: http://www.wisegeek.org/what-is-dc-sputtering.htm
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